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Process
Function & Flow |
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1.Kitting - Set up failure product information in management system. |
2.RI - Failure product function and visual inspection (Judgement panel NDF / NOR1 / |
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2.RI - Repair). |
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3.B/L - B/L and Inverter rework, panel Dis-ASM / ASM. |
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4.COG - COG re-bond (COG function fail). |
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5.TAB - COF/TAB/FPC re-bond (COF/TAB/FPC function fail). |
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6.PCBA - PCBA repair (Fuse/Power IC/ASIC/VR/Gamma IC). |
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7.FMA - Rework panel analysis, PCBA detailed analysis (Transistor / Diode / Capacitor |
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7.FMA - /Resistor), NOR2 judgement. |
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8.POL - Re-POL, attach POL. |
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9.OQC - Product output function and visual inspection. |
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10.Packing - Product package and input carton box. |